Invention Grant
- Patent Title: Three-dimensional freeform waveguides for chip-chip connections
- Patent Title (中): 用于芯片连接的三维自由波导
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Application No.: US13385504Application Date: 2012-02-23
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Publication No.: US08903205B2Publication Date: 2014-12-02
- Inventor: Christian Koos , Wolfgang Freude , Nicole Lindenmann , Juerg Leuthold
- Applicant: Christian Koos , Wolfgang Freude , Nicole Lindenmann , Juerg Leuthold
- Applicant Address: DE Karlsruhe
- Assignee: Karlsruhe Institute of Technology (KIT)
- Current Assignee: Karlsruhe Institute of Technology (KIT)
- Current Assignee Address: DE Karlsruhe
- Agency: Venable LLP
- Agent Robert Kinberg
- Main IPC: G02B6/30
- IPC: G02B6/30 ; G02B6/43 ; G02B6/138

Abstract:
An optical arrangement includes a plurality of planar substrates with at least one planar integrated optical waveguide on each planar substrate. At least one optical waveguide structure has at least one end connected via an optical connecting structure to one of the planar integrated optical waveguides. The optical waveguide structure is positioned at least partly outside the integration plane for the planar integrated optical waveguide and a refractive index contrast between a core region and a cladding region of the optical waveguide structure is at least 0.01.
Public/Granted literature
- US20130223788A1 Photonic wire bonds Public/Granted day:2013-08-29
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