Invention Grant
US08903686B1 Partitioning electronic circuits for simulation on multicore processors
有权
分离电子电路,用于在多核处理器上进行仿真
- Patent Title: Partitioning electronic circuits for simulation on multicore processors
- Patent Title (中): 分离电子电路,用于在多核处理器上进行仿真
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Application No.: US13797523Application Date: 2013-03-12
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Publication No.: US08903686B1Publication Date: 2014-12-02
- Inventor: William Wai Yan Ho
- Applicant: Worldwide Pro Ltd.
- Applicant Address: CN Hong Kong
- Assignee: Worldwide Pro Ltd.
- Current Assignee: Worldwide Pro Ltd.
- Current Assignee Address: CN Hong Kong
- Agency: Aka Chan LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A circuit is simulated by using distributed computing to obtain a real solution. The circuit may be an entire integrated circuit, portion of an integrated circuit, or a circuit block. A circuit simulation technique of the invention generates a system graph, finds a tree, and partitions the tree into two or more subtrees. The technique identifies global links and local links in the graph. Each subtree may be solved individually using distributed, parallel computing (e.g., using multiple processor cores or multiple processors). Using the results for the subtrees, the technique obtains a real solution, branch voltages and currents, for the circuit.
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