Invention Grant
US08903697B2 Solutions for modeling spatially correlated variations in an integrated circuit
有权
用于建模集成电路中空间相关变化的解决方案
- Patent Title: Solutions for modeling spatially correlated variations in an integrated circuit
- Patent Title (中): 用于建模集成电路中空间相关变化的解决方案
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Application No.: US13233176Application Date: 2011-09-15
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Publication No.: US08903697B2Publication Date: 2014-12-02
- Inventor: Henry W. Trombley , Josef S. Watts
- Applicant: Henry W. Trombley , Josef S. Watts
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent David A. Cain
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A computer-implemented method for modeling Spatially Correlated Variation (SCV) in a design of an Integrated Circuit (IC) is disclosed. In one embodiment, the method includes: generating a set of coefficient values for a position dependent SCV function, the set of coefficient values being selected from a set of random variables; obtaining a set of coordinates defining a position of each of a plurality of devices in a defined field; evaluating the position dependent SCV function to determine a device attribute variation for each of the plurality of devices based upon the coordinates of each of the plurality of devices; modifying at least one model parameter based upon the evaluation of the position dependent SCV function; and running a circuit simulation using the at least one modified model parameter.
Public/Granted literature
- US20130073266A1 SOLUTIONS FOR MODELING SPATIALLY CORRELATED VARIATIONS IN AN INTEGRATED CIRCUIT Public/Granted day:2013-03-21
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