Invention Grant
- Patent Title: High speed serial peripheral interface system
- Patent Title (中): 高速串行外设接口系统
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Application No.: US13657501Application Date: 2012-10-22
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Publication No.: US08904078B2Publication Date: 2014-12-02
- Inventor: Michael DeCesaris , Luke D. Remis , Gregory D. Sellman , Steven L. Vanderlinden
- Applicant: International Business Machines Corporation
- Applicant Address: SG Singapore
- Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Current Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agent Katherine S. Brown; Jeffrey L. Streets
- Main IPC: G06F13/20
- IPC: G06F13/20 ; G06F13/42 ; G06F13/00 ; G06F13/36

Abstract:
A serial peripheral interface (SPI) system including a bus adapter is disclosed. The bus adapter may include a data converter that may be adapted to receive respective first and second data from a first master output peripheral input (MOPI) line and a chip select line from a SPI master device. The data converter may also be adapted to interleave the first and second data, and the data converter may be adapted to transmit the interleaved first and second data synchronously with a second clock signal on a second MOPI line. The bus adapter may also include a clock rate adjuster adapted to generate the second clock signal to transmit to a SPI peripheral device. The second clock signal may be adapted to enable the SPI peripheral device to read the transmitted data.
Public/Granted literature
- US20140115222A1 HIGH SPEED SERIAL PERIPHERAL INTERFACE SYSTEM Public/Granted day:2014-04-24
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