Invention Grant
- Patent Title: Method for manufacturing laminated ceramic electronic component
- Patent Title (中): 叠层陶瓷电子元件的制造方法
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Application No.: US13562544Application Date: 2012-07-31
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Publication No.: US08904610B2Publication Date: 2014-12-09
- Inventor: Tomoro Abe , Hiroyuki Baba
- Applicant: Tomoro Abe , Hiroyuki Baba
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-258278 20081003
- Main IPC: H01G7/00
- IPC: H01G7/00 ; H01G4/30 ; H01G4/232 ; H01G4/012

Abstract:
A method for manufacturing a laminated ceramic electronic component is provided in which a plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.
Public/Granted literature
- US20120291270A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-11-22
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