Invention Grant
- Patent Title: Electronic assembly and method of manufacturing same
- Patent Title (中): 电子组装及其制造方法
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Application No.: US14071791Application Date: 2013-11-05
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Publication No.: US08904633B2Publication Date: 2014-12-09
- Inventor: Mike Blossfeld , Luis Fernando Sanchez
- Applicant: TRW Automotive U.S. LLC
- Applicant Address: US MI Livonia
- Assignee: TRW Automotive U.S. LLC
- Current Assignee: TRW Automotive U.S. LLC
- Current Assignee Address: US MI Livonia
- Agency: Tarolli, Sundheim, Covell & Tummino LLP
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H05K5/00 ; H01R13/447 ; H01R12/50 ; H01R13/506 ; H01R43/20 ; H01R13/66 ; H01R12/72

Abstract:
An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by inter-engaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.
Public/Granted literature
- US20140090246A1 ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING SAME Public/Granted day:2014-04-03
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