Disclosed is a method of including the steps of preparing a substrate having a flow-path-wall member; bonding the flow-path-wall member to a resin layer that is composed of a photo-curing resin and serves as the ejection port member such that spaces serving as the flow paths are provided between the substrate and the photo-curing resin; providing through-holes in the resin layer such that the spaces communicate with the outside air; exposing part of the resin layer to light to form an exposed portion and an unexposed portion; heating the exposed portion of the resin layer; and removing the unexposed portion from the heated resin layer to form the ejection ports, removing the unexposed portion from the heated resin layer to form the ejection ports, thereby forming the ejection port member.