Invention Grant
- Patent Title: Thickness control of substrates
- Patent Title (中): 基材厚度控制
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Application No.: US13669994Application Date: 2012-11-06
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Publication No.: US08904822B2Publication Date: 2014-12-09
- Inventor: Philip Robert LeBlanc , Correy Robert Ustanik
- Applicant: Philip Robert LeBlanc , Correy Robert Ustanik
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Kevin M. Able
- Main IPC: C03B17/06
- IPC: C03B17/06 ; C03B18/04

Abstract:
A thickness of at least one preselected portion of a substrate, such as glass substrate for example, is controlled. A laser beam is directed to the at least one preselected portion of the substrate in a viscous state, thereby increasing a temperature and reducing a viscosity of the at least one preselected portion of the substrate in a viscous state sufficiently to cause the at least one preselected portion of the glass substrate to attain a desired thickness. The laser beam after it is generated can be directed to a reflecting surface from which the laser beam is reflected to the at least one preselected portion of the substrate in the viscous state. The substrate can comprise a glass ribbon produced in a downdraw glass forming process for example, and the laser beam can be directed onto a plurality of preselected portions of the glass ribbon.
Public/Granted literature
- US20140123703A1 THICKNESS CONTROL OF SUBSTRATES Public/Granted day:2014-05-08
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