Invention Grant
- Patent Title: Electronic component and method for manufacturing the electronic component
- Patent Title (中): 用于制造电子部件的电子部件和方法
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Application No.: US13376439Application Date: 2010-04-23
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Publication No.: US08904864B2Publication Date: 2014-12-09
- Inventor: Ronny Ludwig
- Applicant: Ronny Ludwig
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102009026806 20090608
- International Application: PCT/EP2010/055460 WO 20100423
- International Announcement: WO2010/142491 WO 20101216
- Main IPC: G01P15/00
- IPC: G01P15/00 ; H05K13/00 ; H05K5/00 ; G01D11/24
Abstract:
AN electronic component includes at least one microcomponent which is contacted with, and fastened to, a support element. The support element includes a spring element which is configured for fastening the microcomponent, and the spring element is engaged in the support element with the aid of a detent in order to fasten the microcomponent to the support element.
Public/Granted literature
- US20120144914A1 Electronic component and method for manufacturing the electronic component Public/Granted day:2012-06-14
Information query
