Invention Grant
- Patent Title: Liquid processing apparatus and liquid processing method
- Patent Title (中): 液体处理装置和液体处理方法
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Application No.: US13495111Application Date: 2012-06-13
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Publication No.: US08905051B2Publication Date: 2014-12-09
- Inventor: Jiro Higashijima
- Applicant: Jiro Higashijima
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2011-133189 20110615
- Main IPC: B08B3/04
- IPC: B08B3/04 ; H01L21/67

Abstract:
Disclosed are a liquid processing apparatus and a liquid processing method that can prevent a substrate in a processing chamber from being contaminated due to contaminants attached to a nozzle supporting arm. The liquid processing apparatus includes a processing chamber in which a substrate holder holding a substrate and a cup disposed around the substrate holder are provided; a nozzle configured to supply a fluid to the substrate held by the substrate holder; and a nozzle supporting arm configured to support the nozzle. A gas ejection mechanism is installed at the nozzle supporting arm to eject a gas toward a front end surface of the nozzle supporting arm.
Public/Granted literature
- US20120318301A1 LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD Public/Granted day:2012-12-20
Information query
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