Invention Grant
- Patent Title: Device for releasing an interconnect layer that provides connection between a carrier and a wafer
- Patent Title (中): 用于释放提供载体和晶片之间的连接的互连层的装置
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Application No.: US13961940Application Date: 2013-08-08
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Publication No.: US08905111B2Publication Date: 2014-12-09
- Inventor: Erich Thallner
- Applicant: EV Group GmbH
- Applicant Address: AT St. Florian
- Assignee: EV Group GmbH
- Current Assignee: EV Group GmbH
- Current Assignee Address: AT St. Florian
- Agency: Kusner & Jaffe
- Priority: EP09003874 20090318
- Main IPC: B32B38/10
- IPC: B32B38/10 ; B32B43/00 ; H01L21/67
Abstract:
A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.
Public/Granted literature
- US20130327485A1 DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION BETWEEN A CARRIER AND A WAFER Public/Granted day:2013-12-12
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