Invention Grant
- Patent Title: Module for use in stacking the thin plate panel and method of stacking the thin plate panel
- Patent Title (中): 用于堆叠薄板的模块和堆叠薄板的方法
-
Application No.: US13336187Application Date: 2011-12-23
-
Publication No.: US08905234B2Publication Date: 2014-12-09
- Inventor: Kouichirou Yoshida
- Applicant: Kouichirou Yoshida
- Applicant Address: JP Tokyo
- Assignee: Kyoraku Co., Ltd.
- Current Assignee: Kyoraku Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Maine Cernota & Rardin
- Priority: JP2010-289011 20101225
- Main IPC: B65D85/30
- IPC: B65D85/30 ; B65D57/00 ; B65D81/05 ; B65D85/48
Abstract:
A module for use in stacking plate panels, having: a supporting portion a load transmitting portion, connected to the outside of a supporting portion and a portion for positioning the plate panels horizontally, wherein the load transmitting portion includes receiving surfaces formed on the upper and lower portions of the module, and when the releasing surface of one module is mounted on the receiving surface of a second module, upon stacking the upper module on the lower module, the positioning portion has an upper engaging portion attached to an edge of the receiving surface, and limits a relative movement of the upper module to the lower module, and a lower engaging portion attached to the edge on the same side as the releasing surface on which the upper engaging portion is formed to offset the upper engaging portion, and limits a relative movement of the upper and lower modules.
Public/Granted literature
- US20120163954A1 MODULE FOR USE IN STACKING THE THIN PLATE PANEL AND METHOD OF STACKING THE THIN PLATE PANEL Public/Granted day:2012-06-28
Information query
IPC分类:
