Invention Grant
- Patent Title: Wireless integrated circuit device and method of manufacturing the same
- Patent Title (中): 无线集成电路装置及其制造方法
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Application No.: US13961995Application Date: 2013-08-08
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Publication No.: US08905296B2Publication Date: 2014-12-09
- Inventor: Tsuyoshi Mukai , Yuya Dokai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-263197 20111201
- Main IPC: G06F17/00
- IPC: G06F17/00 ; G06K19/07 ; H01Q9/16 ; G06K19/077 ; H01L21/52

Abstract:
A wireless IC device includes a base material sheet having a long-side direction and a short-side direction, an antenna element provided on a surface of the base material sheet and that includes two radiation portions extending in the long side direction with a predetermined gap therebetween and two connection portions located in a gap through which the two radiation portions oppose each other, a wireless IC element connected to the two connection portions via a conductive bonding material, and a resist layer that covers the two radiation portions and does not cover the two connection portions and at least areas adjacent to the connection portions in the short-side direction.
Public/Granted literature
- US20130320098A1 WIRELESS INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-12-05
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