Invention Grant
- Patent Title: Wireless IC device
- Patent Title (中): 无线IC设备
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Application No.: US13099392Application Date: 2011-05-03
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Publication No.: US08905316B2Publication Date: 2014-12-09
- Inventor: Yuya Dokai , Nihei Kaishita , Hiroshi Nonogaki , Ryohei Goto , Takahiro Yamaguchi , Kazuyuki Ikeda
- Applicant: Yuya Dokai , Nihei Kaishita , Hiroshi Nonogaki , Ryohei Goto , Takahiro Yamaguchi , Kazuyuki Ikeda
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-112675 20100514
- Main IPC: G06K19/06
- IPC: G06K19/06 ; H01Q1/22 ; G06K19/077 ; H01Q1/38
Abstract:
A wireless IC device includes a dielectric body, a metal pattern that is provided on a surface of the dielectric body and that defines a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. A plurality of slits are provided on at least one surface of the dielectric body so as to provide flexibility for the dielectric body.
Public/Granted literature
- US20110278362A1 WIRELESS IC DEVICE Public/Granted day:2011-11-17
Information query
