Invention Grant
- Patent Title: Vacuum relief
- Patent Title (中): 真空缓解
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Application No.: US13777576Application Date: 2013-02-26
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Publication No.: US08905538B2Publication Date: 2014-12-09
- Inventor: Geoffrey F. Schmid , Kevin T. Kersey
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/01
- IPC: B41J2/01
Abstract:
A surface has a vacuum and a vacuum relief.
Public/Granted literature
- US20130228088A1 VACUUM RELIEF Public/Granted day:2013-09-05
Information query
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