Methods and devices include a patterning device positioned along a processing path. The patterning device forms one or more holes through workpieces at a contact location of the workpieces. A transport device is positioned along the processing path. The transport device removes the workpieces from the processing path and stacks the workpieces by simultaneously moving at least two of the workpieces together in workpiece sets. The transport device comprising a vacuum device that contacts the contact location of the top workpiece within each of the workpiece sets. The vacuum device applies vacuum through the holes of the top workpiece to the bottom workpiece within each of the workpiece sets to maintain the workpieces together in the workpiece sets when performing the removing and the stacking.