Invention Grant
- Patent Title: Ultrathin wafer transport systems
- Patent Title (中): 超薄晶圆输送系统
-
Application No.: US13653408Application Date: 2012-10-17
-
Publication No.: US08905680B2Publication Date: 2014-12-09
- Inventor: Masahiro Lee
- Applicant: Masahiro Lee
- Agency: Lodestar Patents, PLLC
- Agent Raymond J. E. Hall
- Main IPC: B65G47/24
- IPC: B65G47/24 ; H01L21/683 ; B65G51/03
Abstract:
An improved silicon wafer transport system. More particularly, this invention relates to providing new wafer-transport apparatus having geometries configured to minimize damage to the wafer while assisting in maintaining multi-orientation positioning of the wafer during transport by the tool.
Public/Granted literature
- US20130108378A1 Ultrathin Wafer Transport Systems Public/Granted day:2013-05-02
Information query
IPC分类:
