Invention Grant
- Patent Title: Ultrasonic machining assembly for use with portable devices
- Patent Title (中): 超声波加工组件,用于便携式设备
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Application No.: US13094936Application Date: 2011-04-27
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Publication No.: US08905689B2Publication Date: 2014-12-09
- Inventor: Matthew A. Short
- Applicant: Matthew A. Short
- Applicant Address: US OH Columbus
- Assignee: Edison Welding Institute
- Current Assignee: Edison Welding Institute
- Current Assignee Address: US OH Columbus
- Agency: McNees, Wallace & Nurick, LLC
- Main IPC: B23B37/00
- IPC: B23B37/00 ; B23Q5/04 ; B23B29/12

Abstract:
A machining system that includes an ultrasonic machining assembly, wherein the ultrasonic machining assembly further includes a machining tool; a collet adapted to receive the machining tool; and an ultrasonic transducer, wherein the ultrasonic transducer is operative to transmit acoustical vibrations to the machining tool; and a machining apparatus, wherein the machining apparatus is adapted to receive and secure the ultrasonic machining assembly, and wherein the machining apparatus is operative to transmit torque to the machining tool by applying rotary motion to the ultrasonic machining assembly.
Public/Granted literature
- US20110268516A1 ULTRASONIC MACHINING ASSEMBLY FOR USE WITH PORTABLE DEVICES Public/Granted day:2011-11-03
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