Invention Grant
- Patent Title: Connector and semiconductor testing device including the connector
- Patent Title (中): 连接器和半导体测试装置包括连接器
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Application No.: US13378007Application Date: 2010-06-30
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Publication No.: US08905788B2Publication Date: 2014-12-09
- Inventor: Kyoko Oniyama , Akinori Mizumura , Shin Sakiyama , Hiroyuki Hama , Hiromitsu Takasu
- Applicant: Kyoko Oniyama , Akinori Mizumura , Shin Sakiyama , Hiroyuki Hama , Hiromitsu Takasu
- Applicant Address: JP Yamato JP Tokyo
- Assignee: Molex Japan Co. Ltd.,Advantest Corporation
- Current Assignee: Molex Japan Co. Ltd.,Advantest Corporation
- Current Assignee Address: JP Yamato JP Tokyo
- Agent Timothy M. Morella
- Priority: JP2009-156360 20090630
- International Application: PCT/US2010/040526 WO 20100630
- International Announcement: WO2011/002840 WO 20110106
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H01R13/6473 ; H01R12/71 ; H01R13/6471
Abstract:
Each of the signal terminal and the ground terminal includes a first extending portion extending toward its tip end, and a second extending portion extending in a direction opposite to the first extending portion. The first extending portion is formed such that a width thereof is smaller than a width of the second extending portion. The housing includes a first housing into which the first extending portions are inserted, and a second housing into which the second extending portions are inserted. The second housing is formed separately from the first housing, and the first housing includes a wall portion located between the first extending portion of the signal terminal and the first extending portion of the ground terminal.
Public/Granted literature
- US20120088410A1 CONNECTOR AND SEMICONDUCTOR TESTING DEVICE INCLUDING THE CONNECTOR Public/Granted day:2012-04-12
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