Invention Grant
- Patent Title: Component and method for assembling an implant arrangement
- Patent Title (中): 用于组装植入装置的组件和方法
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Application No.: US13687387Application Date: 2012-11-28
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Publication No.: US08906091B2Publication Date: 2014-12-09
- Inventor: Georg Duda , Markus Heller
- Applicant: Synthes USA, LLC
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, LLC
- Current Assignee: DePuy Synthes Products, LLC
- Current Assignee Address: US MA Raynham
- Agency: Fay Kaplun & Marcin, LLP
- Priority: DE102004006501 20040210
- Main IPC: A61B5/00
- IPC: A61B5/00 ; A61B5/11 ; A61B5/145 ; A61F2/20 ; A61B5/07 ; A61B17/68 ; A61B17/70 ; A61F2/28 ; A61B17/00 ; A61B19/00

Abstract:
A component for an arrangement at an implant includes a sensor detecting a measurement variable and generating measuring data corresponding to the detected measurement variable; telemetry device transmitting data; a data transmission connection between the sensor and the telemetry device for the transmission of the measuring data therebetween; and an assembly arrangement detachably mounting the component in an implant recess of the implant wherein the component is configured to be insertable through an implant recess of an implant positioned over a target portion of a bone so that the component extends through the opening toward an outer periphery of the target portion of the bone.
Public/Granted literature
- US20130090732A1 COMPONENT AND METHOD FOR ASSEMBLING AN IMPLANT ARRANGEMENT Public/Granted day:2013-04-11
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