Invention Grant
- Patent Title: Copper alloy for sliding materials
- Patent Title (中): 铜合金滑动材料
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Application No.: US13641880Application Date: 2011-04-20
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Publication No.: US08906129B2Publication Date: 2014-12-09
- Inventor: Tomohiro Sato , Yoshimasa Hirai , Toru Maruyama , Takeshi Kobayashi
- Applicant: Tomohiro Sato , Yoshimasa Hirai , Toru Maruyama , Takeshi Kobayashi
- Applicant Address: JP Osaka
- Assignee: Kurimoto, Ltd.
- Current Assignee: Kurimoto, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-099917 20100423
- International Application: PCT/JP2011/059713 WO 20110420
- International Announcement: WO2011/132703 WO 20111027
- Main IPC: C22C29/00
- IPC: C22C29/00 ; C22C32/00 ; C22C1/04 ; C22C9/02 ; B22F7/02 ; B22F7/08 ; B22F9/08 ; C22C9/00 ; C22C9/10
Abstract:
A copper alloy having excellent sliding performance is produced without relying on lead or molybdenum. The copper alloy contains a sintered Cu5FeS4 material produced by sintering a raw material powder that comprises Cu, Fe and S and is produced by a gas atomizing method.
Public/Granted literature
- US20130036865A1 COPPER ALLOY FOR SLIDING MATERIALS Public/Granted day:2013-02-14
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