Invention Grant
US08906165B2 Substrate processing method, storage medium storing computer program for performing substrate processing method, and substrate processing apparatus
有权
基板处理方法，存储用于执行基板处理方法的计算机程序的存储介质和基板处理装置
- Patent Title: Substrate processing method, storage medium storing computer program for performing substrate processing method, and substrate processing apparatus
- Patent Title (中): 基板处理方法，存储用于执行基板处理方法的计算机程序的存储介质和基板处理装置
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Application No.: US13161714Application Date: 2011-06-16
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Publication No.: US08906165B2Publication Date: 2014-12-09
- Inventor: Teruomi Minami , Naoyuki Okamura , Hirotaka Maruyama , Yosuke Kawabuchi
- Applicant: Teruomi Minami , Naoyuki Okamura , Hirotaka Maruyama , Yosuke Kawabuchi
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2010-138484 20100617
- Main IPC: B08B7/04
- IPC: B08B7/04 ; H01L21/02 ; H01L21/67
Abstract:
In a substrate processing method according to the present invention, a substrate is first processed using a chemical liquid. Next, the substrate is rinsed by supplying a rinsing liquid thereto while the substrate is being rotated. Thereafter, the substrate is dried while the substrate is being rotated. The drying of the substrate includes reducing a rotating speed of the substrate to a first rotating speed lower than that of the substrate during the rinsing of the substrate, while supplying the rinsing liquid to a central portion of the substrate; moving, from the central portion of the substrate toward a peripheral edge portion thereof, a rinsing liquid supply position to which the rinsing liquid is supplied, after the rotating speed of the substrate has been reduced to the first rotating speed; and supplying a drying liquid to the substrate, after the rinsing liquid supply position has been moved.
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