A device having one or more optical elements and an ambient light sensor integrated on a single substrate (e.g., wafer) and a method (e.g., process) for making same is described herein. The process includes the step of forming the ambient light sensor on a first surface of the substrate. The process further includes the step of forming a plurality of recesses in a second surface of the substrate, the second surface being located opposite the first surface. The process further includes depositing silicon dioxide into the plurality of recesses. The process further includes etching a pattern into the silicon dioxide (e.g., glass) to form the optical elements.