Invention Grant
- Patent Title: Method of encapsulation of a microcomponent
- Patent Title (中): 微型组件的封装方法
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Application No.: US13977897Application Date: 2012-01-02
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Publication No.: US08906750B2Publication Date: 2014-12-09
- Inventor: Fabrice Jacquet , David Henry
- Applicant: Fabrice Jacquet , David Henry
- Applicant Address: FR Paris
- Assignee: Commissariat a l'energie atomique et aux energies alternatives
- Current Assignee: Commissariat a l'energie atomique et aux energies alternatives
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1150046 20110104; FR1150047 20110104
- International Application: PCT/EP2012/050023 WO 20120102
- International Announcement: WO2012/093105 WO 20120712
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81C1/00 ; B81B7/00
Abstract:
A method for encapsulating a microcomponent positioned on a substrate, including: a) production of an electrical contact pad on the substrate; b) production of a portion of sacrificial material covering the microcomponent and the electrical contact pad; c) production of an encapsulation layer covering the sacrificial material and a first face of the substrate; d) production, through the substrate, of a hole aligned with the electrical contact pad and emerging at the portion of sacrificial material; e) elimination of the portion of sacrificial material through the hole; f) production, in the hole, of a conductive portion electrically connected to the electrical contact pad, forming a conductive via.
Public/Granted literature
- US20130288429A1 METHOD OF ENCAPSULATION OF A MICROCOMPONENT Public/Granted day:2013-10-31
Information query
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