Invention Grant
US08906763B2 Method of manufacturing a dynamic random access memory (DRAM) including forming contact pads of adjacent cells by laterally etching a contact opening of a cell therebetween
有权
制造动态随机存取存储器(DRAM)的方法,包括通过横向蚀刻其间的单元的接触开口来形成相邻单元的接触垫
- Patent Title: Method of manufacturing a dynamic random access memory (DRAM) including forming contact pads of adjacent cells by laterally etching a contact opening of a cell therebetween
- Patent Title (中): 制造动态随机存取存储器(DRAM)的方法,包括通过横向蚀刻其间的单元的接触开口来形成相邻单元的接触垫
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Application No.: US13540816Application Date: 2012-07-03
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Publication No.: US08906763B2Publication Date: 2014-12-09
- Inventor: Jong-Chul Park , Byung-Jin Kang , Sang-Sup Jeong
- Applicant: Jong-Chul Park , Byung-Jin Kang , Sang-Sup Jeong
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce
- Priority: KR10-2011-0065865 20110704
- Main IPC: H01L21/8242
- IPC: H01L21/8242 ; H01L27/108 ; H01L21/768

Abstract:
A DRAM device includes a substrate including an active region having an island shape and a buried gate pattern. A mask pattern is over an upper surface portion of the substrate between portions of the buried gate pattern. A capping insulating layer fills a gap between portions of the mask pattern. A first pad contact penetrates the capping insulating layer and the mask pattern, and contacts a first portion of the substrate in the active region. Second pad contacts are under the capping insulating layer, and contact a second portion of the substrate in the active region positioned at both sides of the first pad contact. A spacer is between the first and second pad contacts to insulate the first and second pad contacts. A bit line configured to electrically connect with the first pad contact, and a capacitor configured to electrically connect with the second pad contacts, are provided.
Public/Granted literature
- US20130009226A1 DRAM DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2013-01-10
Information query
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