Invention Grant
US08906797B2 Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
有权
具有焊料润湿垫的微电子倒装芯片封装及相关制造方法
- Patent Title: Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
- Patent Title (中): 具有焊料润湿垫的微电子倒装芯片封装及相关制造方法
-
Application No.: US13706062Application Date: 2012-12-05
-
Publication No.: US08906797B2Publication Date: 2014-12-09
- Inventor: Hunt Hang Jiang
- Applicant: Monolithic Power Systems, Inc.
- Applicant Address: US CA San Jose
- Assignee: Monolithic Power Systems, Inc.
- Current Assignee: Monolithic Power Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Perkins Coie LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/56 ; H01L23/495 ; H01L23/31 ; H01L21/52 ; H01L23/00
Abstract:
Processes of assembling microelectronic packages with lead frames and/or other suitable substrates are described herein. In one embodiment, a method for fabricating a semiconductor assembly includes forming an attachment area and a non-attachment area on a lead finger of a lead frame. The attachment area is more wettable to the solder ball than the non-attachment area during reflow. The method also includes contacting a solder ball carried by a semiconductor die with the attachment area of the lead finger, reflowing the solder ball while the solder ball is in contact with the attachment area of the lead finger, and controllably collapsing the solder ball to establish an electrical connection between the semiconductor die and the lead finger of the lead frame.
Public/Granted literature
- US20140004662A1 MICROELECTRONIC FLIP CHIP PACKAGES WITH SOLDER WETTING PADS AND ASSOCIATED METHODS OF MANUFACTURING Public/Granted day:2014-01-02
Information query
IPC分类:
