Invention Grant
- Patent Title: Adhesive agent composition and laminated body
- Patent Title (中): 粘合剂组合物和层压体
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Application No.: US13980772Application Date: 2012-01-20
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Publication No.: US08907025B2Publication Date: 2014-12-09
- Inventor: Hiroki Sugi , Bungo Yasui , Seiji Maeda , Katsuyuki Ueki , Kenshiro Shimada
- Applicant: Hiroki Sugi , Bungo Yasui , Seiji Maeda , Katsuyuki Ueki , Kenshiro Shimada
- Applicant Address: JP Tokyo
- Assignee: Toyo Ink SC Holdings Co., Ltd.
- Current Assignee: Toyo Ink SC Holdings Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Brinks Gilson & Lione
- Priority: JP2011-010335 20110121
- International Application: PCT/JP2012/051257 WO 20120120
- International Announcement: WO2012/099256 WO 20120726
- Main IPC: C09J175/08
- IPC: C09J175/08 ; C08G18/08 ; C08L63/02 ; C08G18/48 ; C08G18/42 ; C08G18/32 ; C08G18/76 ; C09J175/06 ; C08G18/75 ; C08G18/10 ; C08G18/73 ; C08G18/58 ; C08G18/72 ; C09J11/06 ; C08G18/40

Abstract:
The present invention is to provide an adhesive agent composition, including: a main agent containing a polyether polyurethane polyol and a bisphenol A-type epoxy resin; and a curing agent, wherein the polyether polyurethane polyol is obtained by reacting a polyalkylene glycol including repeating units each having a carbon number of 3 or 4 and an alkane diol monomer with an organic diisocyanate at an equivalent ratio (NCO/OH) of 0.7 or more but less than 1, a weight average molecular weight thereof is in the range of 20,000 to 70,000, and an urethane bond equivalent thereof is in the range of 320 to 600 g/eq, and wherein a number average molecular weight of the bisphenol A-type epoxy resin is in the range of 400 to 5,000, and the bisphenol A-type epoxy resin is of a solid state or a semisolid state at normal temperature.
Public/Granted literature
- US20130296504A1 ADHESIVE AGENT COMPOSITION AND LAMINATED BODY Public/Granted day:2013-11-07
Information query
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