Invention Grant
- Patent Title: Heating control system, deposition device provided therewith, and temperature control method
- Patent Title (中): 加热控制系统,提供的沉积装置和温度控制方法
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Application No.: US13577109Application Date: 2011-03-29
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Publication No.: US08907254B2Publication Date: 2014-12-09
- Inventor: Hidekazu Sakagami , Toshinori Okada
- Applicant: Hidekazu Sakagami , Toshinori Okada
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Edwards Wildman Palmer LLP
- Agent David G. Conlin; Steven M. Jensen
- Priority: JP2010-089545 20100408
- International Application: PCT/JP2011/057825 WO 20110329
- International Announcement: WO2011/125654 WO 20111013
- Main IPC: H05B1/02
- IPC: H05B1/02 ; H01L21/67 ; C23C16/46 ; C23C16/52

Abstract:
A heating control system which allows a plurality of heaters to heat an object without depending on a variation in characteristics among a plurality of heater power sources includes: a thermocouple which detects a temperature of an object to be heated; temperature control means that receives a target temperature and a current temperature, and carries out electric power control so that these temperatures match; electric current and voltage detecting means for detecting an electric power value and a current electric power; and target electric power calculating means that receives the electric power value, and calculates the target electric power by multiplying the electric power value by a given ratio. The temperature control means receives the target electric power and the current electric power, and carries out electric power control so that the current electric power matches the target electric power.
Public/Granted literature
- US20130020311A1 HEATING CONTROL SYSTEM, DEPOSITION DEVICE PROVIDED THEREWITH, AND TEMPERATURE CONTROL METHOD Public/Granted day:2013-01-24
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