Invention Grant
- Patent Title: Light-emitting dies incorporating wavelength-conversion materials and related methods
- Patent Title (中): 掺有波长转换材料的发光管和相关方法
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Application No.: US13949543Application Date: 2013-07-24
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Publication No.: US08907362B2Publication Date: 2014-12-09
- Inventor: Michael A. Tischler
- Applicant: Michael A. Tischler
- Applicant Address: CA Burnaby
- Assignee: Cooledge Lighting Inc.
- Current Assignee: Cooledge Lighting Inc.
- Current Assignee Address: CA Burnaby
- Agency: Bingham McCutchen LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/50 ; H01L29/00 ; H01L25/00
Abstract:
In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
Public/Granted literature
- US20140319560A1 LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS Public/Granted day:2014-10-30
Information query
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