Invention Grant
- Patent Title: Copper ball bond features and structure
- Patent Title (中): 铜球结合的特点和结构
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Application No.: US13594732Application Date: 2012-08-24
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Publication No.: US08907485B2Publication Date: 2014-12-09
- Inventor: Leo M. Higgins, III , Chu-Chung Lee
- Applicant: Leo M. Higgins, III , Chu-Chung Lee
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Terrile, Cannatti, Chambers & Holland, LLP
- Agent Michael Rocco Cannatti
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L21/607 ; H01L21/603 ; H01L23/485
Abstract:
An integrated circuit wire bond connection is provided having an aluminum bond pad (51) that is directly bonded to a copper ball (52) to form an aluminum splash structure (53) and associated crevice opening (55) at a peripheral bond edge of the copper ball (54), where the aluminum splash structure (53) is characterized by a plurality of geometric properties indicative of a reliable copper ball bond, such as lateral splash size, splash shape, relative position of splash-ball crevice to the aluminum pad, crevice width, crevice length, crevice angle, and/or crevice-pad splash index.
Public/Granted literature
- US20140054781A1 Copper Ball Bond Features and Structure Public/Granted day:2014-02-27
Information query
IPC分类:
