Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13665170Application Date: 2012-10-31
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Publication No.: US08907492B2Publication Date: 2014-12-09
- Inventor: Kazuyuki Nakanishi
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2010-236526 20101021
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L27/118 ; H01L27/02

Abstract:
Power supply plugs, which couple a power supply active region to a power supply metal interconnect, include a plurality of first plugs, which are arranged at first pitches of a predetermined length, and a second plug, which is spaced apart from the closest one of the first plugs by a center-to-center distance different from an integral multiple of the predetermined length. Among the power supply plugs, the second plug is closest to a third plug, which is an interconnect plug closest to the power supply active region and the power supply metal interconnect.
Public/Granted literature
- US20130056803A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-03-07
Information query
IPC分类: