Invention Grant
- Patent Title: Manufacturing an underfill in a semiconductor chip package
- Patent Title (中): 在半导体芯片封装中制造底层填料
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Application No.: US13943998Application Date: 2013-07-17
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Publication No.: US08907503B2Publication Date: 2014-12-09
- Inventor: Thomas J. Brunschwiler , Javier V. Goicochea , Stefano S. Oggioni , Gerd Schlottig
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Priority: GB1213365.8 20120727
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/31 ; H01L23/29
Abstract:
A method for manufacturing an underfill in a semiconductor chip stack having a cavity between a first surface and a second surface includes providing at least one access hole in one of the first or second surface; providing at least one vent hole in the one of the first or second surfaces; and applying a viscous filling material through the at least one access hole into the cavity thereby squeezing out air or gas through the at least one vent hole.
Public/Granted literature
- US20140027932A1 MANUFACTURING AN UNDERFILL IN A SEMICONDUCTOR CHIP PACKAGE Public/Granted day:2014-01-30
Information query
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