Invention Grant
US08908145B2 Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
有权
图案形成装置和图案形成方法，移动体驱动系统和移动体驱动方法，曝光装置和曝光方法以及装置制造方法
- Patent Title: Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
- Patent Title (中): 图案形成装置和图案形成方法，移动体驱动系统和移动体驱动方法，曝光装置和曝光方法以及装置制造方法
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Application No.: US11708611Application Date: 2007-02-21
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Publication No.: US08908145B2Publication Date: 2014-12-09
- Inventor: Yuichi Shibazaki
- Applicant: Yuichi Shibazaki
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2006-044589 20060221
- Main IPC: G03B27/42
- IPC: G03B27/42 ; G03F7/20 ; G03F9/00
Abstract:
A partial section of an aerial image measuring unit is arranged at a wafer stage and part of the remaining section is arranged at a measurement stage, and the aerial image measuring unit measures an aerial image of a mark formed by a projection optical system. Therefore, for example, when the aerial image measuring unit measures a best focus position of the projection optical system, the measurement can be performed using the position of the wafer stage, at which a partial section of the aerial image measuring unit is arranged, in a direction parallel to an optical axis of the projection optical system as a datum for the best focus position. Accordingly, when exposing an object with illumination light, the position of the wafer stage in the direction parallel to the optical axis is adjusted with high accuracy based on the measurement result of the best focus position.
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