An exposure method for color filter substrate is provided. As shown in FIG. 7(a), exposure is performed while a substrate 20 to which a photoresist has been applied is being transported in the Y direction, to simultaneously form first layers 81 and layers 91 in first non-display regions 51 (regions indicated by hatching sloping upward to the right) and the display region, respectively, on the substrate 20. Next, as shown in (b), the substrate 20 is rotated by 90 degrees, and exposure is performed while the substrate 20 is being transported in the X direction, to form second layers 82 in second non-display regions 52 (regions indicated by hatching sloping upward to the right). Thus, dummy PSs 71 and dummy PSs 72 arranged with desired pitches and having desired shapes can be formed in the first non-display regions 51 and the second non-display regions 52, respectively.