An electronic apparatus includes: a casing that is formed by press molding and that has positioning holes; a first assembly having positioning projections that are inserted into the positioning holes and at whose distal ends are provided buffer portions that project-out from the positioning holes, the first assembly being assembled to an inner side of the casing in a positioned state due to the positioning projections being inserted into the positioning holes; and a second assembly having engaging portions, and being assembled to the inner side of the casing in a state of being positioned at the first assembly, due to the engaging portions being engaged with engaged portions that are formed at the first assembly.