Invention Grant
US08908466B2 Multi-column addressing mode memory system including an integrated circuit memory device
有权
多列寻址模式存储器系统,包括集成电路存储器件
- Patent Title: Multi-column addressing mode memory system including an integrated circuit memory device
- Patent Title (中): 多列寻址模式存储器系统,包括集成电路存储器件
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Application No.: US13860825Application Date: 2013-04-11
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Publication No.: US08908466B2Publication Date: 2014-12-09
- Inventor: Frederick A. Ware , Lawrence Lai , Chad A. Bellows , Wayne S. Richardson
- Applicant: Frederick A. Ware , Lawrence Lai , Chad A. Bellows , Wayne S. Richardson
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Main IPC: G11C8/14
- IPC: G11C8/14 ; G11C8/16 ; G11C8/12 ; G11C8/10

Abstract:
A memory system includes a master device, such as a graphics controller or processor, and an integrated circuit memory device operable in a dual column addressing mode. The integrated circuit memory device includes an interface and column decoder to access a row of storage cells or a page in a memory bank. During a first mode of operation, a first row of storage cells in a first memory bank is accessible in response to a first column address. During a second mode of operation, a first plurality of storage cells in the first row of storage cells is accessible in response to a second column address during a column cycle time interval. A second plurality of storage cells in the first row of storage cells is accessible in response to a third column address during the column cycle time interval. The first and second pluralities of storage cells are concurrently accessible from the interface.
Public/Granted literature
- US20140003131A1 MULTI-COLUMN ADDRESSING MODE MEMORY SYSTEM INCLUDING AN INTEGRATED CIRCUIT MEMORY DEVICE Public/Granted day:2014-01-02
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