An enclosure for a laser package the enclosure being configured to receive a laser component within the enclosure, and further configured to receive for a driver integrated circuit (IC) (34) on the exterior of the enclosure, wherein the enclosure comprises first external electrical contacts (52) electrically connected to respective first IC electrical contacts (60), and second IC electrical contacts (62) electrically connected to respective first internal electrical contacts (64), wherein the first and second IC electrical contacts (60, 62) are configured for electrical connection to the driver IC (34). Heat dissipation of the driver IC is improved for the IC being mounted outside of the enclosure.