Invention Grant
- Patent Title: Integrated circuit and wireless communication apparatus
- Patent Title (中): 集成电路和无线通信装置
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Application No.: US13759192Application Date: 2013-02-05
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Publication No.: US08909168B2Publication Date: 2014-12-09
- Inventor: Fumitaka Kondo
- Applicant: Fumitaka Kondo
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: JP2012-032538 20120217
- Main IPC: H04B1/44
- IPC: H04B1/44

Abstract:
Provided is an integrated circuit including a first switch element provided on a transmission path, a second switch element provided on a reception path, a third switch element provided between an input-side node of the first switch element and a ground potential, and a fourth switch element provided between an output-side node of the second switch element and the ground potential. The second switch element and the third switch element are turned on when the first switch element and the fourth switch element are turned off. The second switch element and the third switch element are turned off when the first switch element and the fourth switch element are turned on. An output-side node of the first switch element is connected to an input-side node of the second switch element, and a size of the first switch element is smaller than a size of the second switch element.
Public/Granted literature
- US20130217344A1 INTEGRATED CIRCUIT AND WIRELESS COMMUNICATION APPARATUS Public/Granted day:2013-08-22
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