Invention Grant
- Patent Title: Systems and methods for making and using contact assemblies for leads of electrical stimulation systems
- Patent Title (中): 制造和使用电刺激系统引线接触组件的系统和方法
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Application No.: US14101861Application Date: 2013-12-10
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Publication No.: US08909354B2Publication Date: 2014-12-09
- Inventor: William George Orinski
- Applicant: Boston Scientific Neuromodulation Corporation
- Applicant Address: US CA Valencia
- Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee: Boston Scientific Neuromodulation Corporation
- Current Assignee Address: US CA Valencia
- Agency: Lowe Graham Jones PLLC
- Agent Bruce E. Black
- Main IPC: A61N1/00
- IPC: A61N1/00 ; A61N1/05

Abstract:
First contacts are disposed along a distal end portion or a proximal end portion of a lead body of an electrical stimulation lead. A contact assembly is disposed along the other of the distal end portion or the proximal end portion of the lead body. The contact assembly includes a tubular-shaped composite structure formed from multiple layered elements mechanically coupled together and rolled together into a tube. Each of the layered elements includes a first electrically-nonconductive substrate, a second electrically-nonconductive substrate, and micro-circuits laminated therebetween. Second contacts are disposed over the composite structure and electrically coupled to a first end portion of at least one of the micro-circuits. Lead-body conductors electrically couple the first contacts to the second contacts. Each of each of the lead-body conductors is attached to a second end portion of at least one of the micro-circuits.
Public/Granted literature
- US20140172056A1 SYSTEMS AND METHODS FOR MAKING AND USING CONTACT ASSEMBLIES FOR LEADS OF ELECTRICAL STIMULATION SYSTEMS Public/Granted day:2014-06-19
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