Invention Grant
- Patent Title: Substrate processing system and substrate processing method
- Patent Title (中): 基板加工系统和基板加工方法
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Application No.: US13114103Application Date: 2011-05-24
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Publication No.: US08909364B2Publication Date: 2014-12-09
- Inventor: Wataru Tsukinoki , Yuichi Yamamoto
- Applicant: Wataru Tsukinoki , Yuichi Yamamoto
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2010-126034 20100601
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677
Abstract:
Provided is a substrate processing system including a group controller which determines a combination of processing apparatuses having the shortest total processing time including the processing end time in a final processing apparatus, determines a predictable elapsed time up to a processing start time by a predetermined downstream processing apparatus for a wafer lot from a processing end time of the wafer lot by a predetermined processing apparatus in the combination of the processing apparatuses, and determines a timing of discharging the substrate to the predetermined processing apparatus or an upstream processing apparatus of the predetermined processing apparatus so that the predictable elapsed time is set within a predetermined time when the predictable elapsed time exceeds the predetermined time.
Public/Granted literature
- US20110292356A1 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD Public/Granted day:2011-12-01
Information query
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