Invention Grant
US08909383B2 Proactive cooling of chips using workload information and controls
有权
使用工作负载信息和控制来主动冷却芯片
- Patent Title: Proactive cooling of chips using workload information and controls
- Patent Title (中): 使用工作负载信息和控制来主动冷却芯片
-
Application No.: US13334903Application Date: 2011-12-22
-
Publication No.: US08909383B2Publication Date: 2014-12-09
- Inventor: Scott J. Hadderman , Daniel J. Kearney , Wei Huang , K. Paul Muller , William J. Rooney , Guillermo J. Silva , Malcolm S. Ware , Emmanuel Yashchin , Peter B. Yocom
- Applicant: Scott J. Hadderman , Daniel J. Kearney , Wei Huang , K. Paul Muller , William J. Rooney , Guillermo J. Silva , Malcolm S. Ware , Emmanuel Yashchin , Peter B. Yocom
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jason H. Sosa; Dennis W. Jung; Margaret Pepper
- Main IPC: G05D23/00
- IPC: G05D23/00 ; G01K7/00 ; H01L35/00 ; H01L37/00 ; H03K3/42 ; H03K17/78
Abstract:
A method to reduce large temperature over/undershoot in a computer system. Using workload data, the method proactively modifies controls of mechanical cooling system to anticipate power and take appropriate actions to maintain temperature. Workload control modifies workload and scheduling to reduce power transients and subsequent temperature deviations. In addition, workload control allows more even distribution of temp across chips, allowing for even wear and reduction of small/ripple/noise temp oscillations. A system and program product for carrying out the method are also provided.
Public/Granted literature
- US20130166095A1 Proactive Cooling Of Chips Using Workload Information and Controls Public/Granted day:2013-06-27
Information query
