Invention Grant
US08910096B2 Focus position adjusting apparatus, reticle, focus position adjusting program, and method of manufacturing semiconductor device
有权
聚焦位置调整装置，掩模版，聚焦位置调整程序以及半导体装置的制造方法
- Patent Title: Focus position adjusting apparatus, reticle, focus position adjusting program, and method of manufacturing semiconductor device
- Patent Title (中): 聚焦位置调整装置，掩模版，聚焦位置调整程序以及半导体装置的制造方法
-
Application No.: US13949617Application Date: 2013-07-24
-
Publication No.: US08910096B2Publication Date: 2014-12-09
- Inventor: Yuji Setta
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-036348 20130226
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G03F7/20 ; H01L21/66
Abstract:
According to one embodiment, a step difference estimation unit, an assist pattern generation unit, and a spherical aberration conversion unit are installed. The step difference estimation unit estimates step difference of a processing layer. The assist pattern generation unit adds an assist pattern having different sensitivity to spherical aberration in an exposure process to a mask pattern based on the step difference of the processing layer. The spherical aberration conversion unit converts the step difference of the processing layer into the spherical aberration.
Public/Granted literature
Information query
