Invention Grant
US08912573B2 Semiconductor device containing HEMT and MISFET and method of forming the same
有权
包含HEMT和MISFET的半导体器件及其形成方法
- Patent Title: Semiconductor device containing HEMT and MISFET and method of forming the same
- Patent Title (中): 包含HEMT和MISFET的半导体器件及其形成方法
-
Application No.: US13777701Application Date: 2013-02-26
-
Publication No.: US08912573B2Publication Date: 2014-12-16
- Inventor: Chung-Yen Chou , Sheng-De Liu , Fu-Chih Yang , Shih-Chang Liu , Chia-Shiung Tsai
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L21/338

Abstract:
A semiconductor structure with a MISFET and a HEMT region includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A third III-V compound layer is disposed on the second III-V compound layer is different from the second III-V compound layer in composition. A source feature and a drain feature are disposed in each of the MISFET and HEMT regions on the third III-V compound layer. A gate electrode is disposed over the second III-V compound layer between the source feature and the drain feature. A gate dielectric layer is disposed under the gate electrode in the MISFET region but above the top surface of the third III-V compound layer.
Public/Granted literature
- US20140239350A1 SEMICONDUCTOR DEVICE CONTAINING HEMT AND MISFET AND METHOD OF FORMING THE SAME Public/Granted day:2014-08-28
Information query
IPC分类: