Invention Grant
US08912635B2 Semiconductor device package and method of making a semiconductor device package
有权
半导体器件封装以及制造半导体器件封装的方法
- Patent Title: Semiconductor device package and method of making a semiconductor device package
- Patent Title (中): 半导体器件封装以及制造半导体器件封装的方法
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Application No.: US13303690Application Date: 2011-11-23
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Publication No.: US08912635B2Publication Date: 2014-12-16
- Inventor: Chip King Tan , Boon Huan Gooi
- Applicant: Chip King Tan , Boon Huan Gooi
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/31
Abstract:
A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.
Public/Granted literature
- US20120068323A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE Public/Granted day:2012-03-22
Information query
IPC分类:
