Invention Grant
- Patent Title: Packaging structure and method of fabricating the same
- Patent Title (中): 包装结构及其制造方法
-
Application No.: US13566296Application Date: 2012-08-03
-
Publication No.: US08912959B2Publication Date: 2014-12-16
- Inventor: Chih-Hsien Chiu , Tsung-Hsien Tsai , Chao-Ya Yang
- Applicant: Chih-Hsien Chiu , Tsung-Hsien Tsai , Chao-Ya Yang
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Edwards Wildman Palmer LLP
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW100137484A 20111017
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q1/24 ; H01Q1/52 ; H01L23/552 ; H01Q1/36 ; H01L23/66 ; H01L23/31
Abstract:
A packaging structure and a method of fabricating the same are provided. The packaging structure includes a substrate, first packaging element disposed on the substrate, a second packaging element disposed on the substrate and spaced apart from the first packaging element, a first antenna disposed on the first packaging element, and a metal layer formed on the second packaging element. The installation of the metal layer and the antenna enhances the electromagnetic shielding effect.
Public/Granted literature
- US20130093629A1 PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2013-04-18
Information query
