Invention Grant
- Patent Title: Heat radiation device and electronic equipment using the same
- Patent Title (中): 散热装置和电子设备使用相同
-
Application No.: US13516135Application Date: 2011-02-03
-
Publication No.: US08913389B2Publication Date: 2014-12-16
- Inventor: Yasuhito Fukui , Takashi Sawa , Shinichi Shinohara
- Applicant: Yasuhito Fukui , Takashi Sawa , Shinichi Shinohara
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2010-022941 20100204; JP2010-022942 20100204
- International Application: PCT/JP2011/000604 WO 20110203
- International Announcement: WO2011/096218 WO 20110811
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/367 ; H01L23/40

Abstract:
Disclosed is a heat radiation device, which is in contact with a first heat-producing component having a higher value of guaranteed temperature and a second heat-producing component having a lower value of guaranteed temperature, and the heat radiation device comprises a metal member provided with a slit. The metal member is divided by the slit to have two heat radiation regions, a first heat radiation region and a second heat radiation region that are loosely coupled with each other in terms of heat conduction. The first heat-producing component is placed in contact with the first heat radiation region, and the second heat-producing component is placed in contact with the second heat radiation region.
Public/Granted literature
- US20120300406A1 HEAT RADIATION DEVICE AND ELECTRONIC EQUIPMENT USING THE SAME Public/Granted day:2012-11-29
Information query