Invention Grant
- Patent Title: High tolerance connection between elements
- Patent Title (中): 元件之间的高公差连接
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Application No.: US12794485Application Date: 2010-06-04
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Publication No.: US08913395B2Publication Date: 2014-12-16
- Inventor: Scott Myers , Mattia Pascolini , Richard Dinh , Trent Weber , Robert Schlub , Josh Nickel , Robert Hill , Nanbo Jin , Tang Tan
- Applicant: Scott Myers , Mattia Pascolini , Richard Dinh , Trent Weber , Robert Schlub , Josh Nickel , Robert Hill , Nanbo Jin , Tang Tan
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/03 ; G06F1/16 ; H04M1/02

Abstract:
This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.
Public/Granted literature
- US20110188178A1 HIGH TOLERANCE CONNECTION BETWEEN ELEMENTS Public/Granted day:2011-08-04
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