Invention Grant
- Patent Title: Compound semiconductor device with mesa structure
- Patent Title (中): 具有台面结构的复合半导体器件
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Application No.: US14066730Application Date: 2013-10-30
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Publication No.: US08916459B2Publication Date: 2014-12-23
- Inventor: Tsuyoshi Takahashi , Kozo Makiyama
- Applicant: Fujitsu Limited
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-220821 20070828
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L29/66 ; H01L29/06 ; H01L29/10 ; H01L29/423 ; H01L29/778 ; H01L21/02

Abstract:
A compound semiconductor device having mesa-shaped element region, and excellent characteristics are provided. The compound semiconductor device has: an InP substrate; an epitaxial lamination mesa formed above the InP substrate and including a channel layer, a carrier supply layer above the channel layer and a contact cap layer above the carrier supply layer; ohmic source electrode and drain electrode formed on the cap layer; a recess formed by removing the cap layer between the source and drain electrodes, and exposing the carrier supply layer; an insulating film formed on the cap layer and retracted from an edge of the cap layer away from the recess; a gate electrode extending from the carrier supply layer in the recess to outside of the mesa; and air gap formed by removing side portion of the channel layer facing the gate electrode outside the mesa.
Public/Granted literature
- US20140057401A1 COMPOUND SEMICONDUCTOR DEVICE WITH MESA STRUCTURE Public/Granted day:2014-02-27
Information query
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