Invention Grant
US08916464B2 Structures and methods for improving solder bump connections in semiconductor devices
有权
用于改善半导体器件中的焊料凸点连接的结构和方法
- Patent Title: Structures and methods for improving solder bump connections in semiconductor devices
- Patent Title (中): 用于改善半导体器件中的焊料凸点连接的结构和方法
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Application No.: US12344711Application Date: 2008-12-29
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Publication No.: US08916464B2Publication Date: 2014-12-23
- Inventor: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter , Timothy D. Sullivan
- Applicant: Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter , Timothy D. Sullivan
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent David Cain
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L21/44 ; H01L23/00
Abstract:
Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a via formed in a dielectric layer to expose a contact pad and a capture pad formed in the via and over the dielectric layer. The capture pad has openings over the dielectric layer to form segmented features. The solder bump is deposited on the capture pad and the openings over the dielectric layer.
Public/Granted literature
- US20100164096A1 Structures and Methods for Improving Solder Bump Connections in Semiconductor Devices Public/Granted day:2010-07-01
Information query
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