Invention Grant
- Patent Title: Method and system for non-destructive distribution profiling of an element in a film
- Patent Title (中): 电影中元素的非破坏性分布分布的方法和系统
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Application No.: US14080050Application Date: 2013-11-14
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Publication No.: US08916823B2Publication Date: 2014-12-23
- Inventor: Paolo deCecco , Bruno Schueler , David Reed , Michael Kwan , David Stephen Ballance
- Applicant: ReVera Incoporated
- Applicant Address: US CA Santa Clara
- Assignee: ReVara, Incorporated
- Current Assignee: ReVara, Incorporated
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor Zafman LLP
- Main IPC: H01J37/26
- IPC: H01J37/26 ; G01N23/227 ; H03F1/26

Abstract:
A method to determine a distribution profile of an element in a film. The method comprises exciting an electron energy of an element deposited in a first film, obtaining a first spectrum associating with the electron energy, and removing a background spectrum from the first spectrum. Removing the background value generates a processed spectrum. The method further includes matching the processed spectrum to a simulated spectrum with a known simulated distribution profile for the element in a film comparable to the first film. A distribution profile is obtained for the element in the first film based on the matching of the processed spectrum to a simulated spectrum selected from the set of simulated spectra.
Public/Granted literature
- US20140070096A1 METHOD AND SYSTEM FOR NON-DESTRUCTIVE DISTRIBUTION PROFILING OF AN ELEMENT IN A FILM Public/Granted day:2014-03-13
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